Bill of materials: Difference between revisions
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For testing and preparing the packaging of the publication. | |||
{| class="wikitable" | {| class="wikitable" | ||
|+ Graduation project & thesis | |||
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! Item !! Qty !! Description !! Category !! Source | ! Item !! Qty !! Description !! Category !! Source | ||
Revision as of 23:31, 6 February 2023
Internal
For testing and preparing the packaging of the publication.
| Item | Qty | Description | Category | Source |
|---|---|---|---|---|
| IC555 | 1 set | Integrated Circuit | Component | |
| Anti-static conductive foam | 1 set | For IC chip storage/packaging | Packaging |