Bill of materials
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Internal
For prototyping and preparing the packaging of the publication.
| Item | Qty | Description | Category | Source |
|---|---|---|---|---|
| IC555 | 1 set | Integrated Circuit | Component | |
| Anti-static conductive foam | 1 set | For IC chip storage/packaging | Packaging |
External
To be published as part of the publication.
| Item | Qty | Description | Category | Source |
|---|---|---|---|---|
| IC555 | 1 piece | Integrated Circuit | Component | |