Bill of materials: Difference between revisions
Jump to navigation
Jump to search
m (→Internal) |
mNo edit summary |
||
Line 1: | Line 1: | ||
=Internal= | =Internal= | ||
For | For prototyping and preparing the packaging of the publication. | ||
{| class="wikitable" | {| class="wikitable" | ||
Line 13: | Line 13: | ||
=External= | =External= | ||
For publishing as part of the publication. | |||
{| class="wikitable" | |||
|+ ChipF(r)ic v1.0 | |||
|- | |||
! Item !! Qty !! Description !! Category !! Source | |||
|- | |||
| IC555 || 1 piece || Integrated Circuit || Component || | |||
|- | |||
| || || || || | |||
|} | |||
==ChipF(r)ic DIY circuit== | ==ChipF(r)ic DIY circuit== |
Revision as of 00:03, 7 February 2023
Internal
For prototyping and preparing the packaging of the publication.
Item | Qty | Description | Category | Source |
---|---|---|---|---|
IC555 | 1 set | Integrated Circuit | Component | |
Anti-static conductive foam | 1 set | For IC chip storage/packaging | Packaging |
External
For publishing as part of the publication.
Item | Qty | Description | Category | Source |
---|---|---|---|---|
IC555 | 1 piece | Integrated Circuit | Component | |