Bill of materials: Difference between revisions
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(Created page with "=Internal= ==Graduation Project & Thesis== {| class="wikitable" |- ! Item !! Qty !! Description !! Source |- | Anti-static conductive foam || 1 set || For IC chip storage/packaging || |- | Example || Example || Example || |- | Example || Example || Example || |} =External= ==ChipF(r)ic DIY circuit==") |
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=Internal= | =Internal= | ||
For prototyping and preparing the packaging of the publication. | |||
{| class="wikitable" | {| class="wikitable" | ||
|+ Graduation project & thesis | |||
|- | |- | ||
! Item !! Qty !! Description !! Source | ! Item !! Qty !! Description !! Category !! Source | ||
|- | |- | ||
| | | IC555 || 1 set || Integrated Circuit || Component || | ||
|- | |- | ||
| | | Anti-static conductive foam || 1 set || For IC chip storage/packaging || Packaging || | ||
|} | |} | ||
=External= | =External= | ||
= | To be published as part of the publication. | ||
{| class="wikitable" | |||
|+ ChipF(r)ic v1.0 | |||
|- | |||
! Item !! Qty !! Description !! Category !! Source | |||
|- | |||
| IC555 || 1 piece || Integrated Circuit || Component || | |||
|- | |||
| || || || || | |||
|} | |||
Latest revision as of 00:04, 7 February 2023
Internal
For prototyping and preparing the packaging of the publication.
| Item | Qty | Description | Category | Source |
|---|---|---|---|---|
| IC555 | 1 set | Integrated Circuit | Component | |
| Anti-static conductive foam | 1 set | For IC chip storage/packaging | Packaging |
External
To be published as part of the publication.
| Item | Qty | Description | Category | Source |
|---|---|---|---|---|
| IC555 | 1 piece | Integrated Circuit | Component | |