Latest revision as of 00:04, 7 February 2023

Internal

For prototyping and preparing the packaging of the publication.

Graduation project & thesis
Item	Qty	Description	Category	Source
IC555	1 set	Integrated Circuit	Component
Anti-static conductive foam	1 set	For IC chip storage/packaging	Packaging

To be published as part of the publication.

ChipF(r)ic v1.0
Item	Qty	Description	Category	Source
IC555	1 piece	Integrated Circuit	Component

@@ Line 13: / Line 13: @@
 =External=
-For publishing as part of the publication.
+To be published as part of the publication.
 {| class="wikitable"
 |+ ChipF(r)ic v1.0
@@ Line 23: / Line 23: @@
 |  ||  ||  ||  ||
 |}
-==ChipF(r)ic DIY circuit==