Latest revision as of 00:04, 7 February 2023

Internal

For prototyping and preparing the packaging of the publication.

Graduation project & thesis
Item	Qty	Description	Category	Source
IC555	1 set	Integrated Circuit	Component
Anti-static conductive foam	1 set	For IC chip storage/packaging	Packaging

To be published as part of the publication.

ChipF(r)ic v1.0
Item	Qty	Description	Category	Source
IC555	1 piece	Integrated Circuit	Component

@@ Line 1: / Line 1: @@
 =Internal=
-==Graduation Project & Thesis==
+For prototyping and preparing the packaging of the publication.
 {| class="wikitable"
+|+ Graduation project & thesis
 |-
 ! Item !! Qty !! Description !! Category !! Source
@@ Line 11: / Line 13: @@
 =External=
-==ChipF(r)ic DIY circuit==
+To be published as part of the publication.
+{| class="wikitable"
+|+ ChipF(r)ic v1.0
+|-
+! Item !! Qty !! Description !! Category !! Source
+|-
+| IC555 || 1 piece || Integrated Circuit || Component ||
+|-
+|  ||  ||  ||  ||
+|}