Bill of materials: Difference between revisions
Jump to navigation
Jump to search
mNo edit summary |
mNo edit summary |
||
Line 13: | Line 13: | ||
=External= | =External= | ||
To be published as part of the publication. | |||
{| class="wikitable" | {| class="wikitable" | ||
|+ ChipF(r)ic v1.0 | |+ ChipF(r)ic v1.0 | ||
Line 23: | Line 23: | ||
| || || || || | | || || || || | ||
|} | |} | ||
Latest revision as of 00:04, 7 February 2023
Internal
For prototyping and preparing the packaging of the publication.
Item | Qty | Description | Category | Source |
---|---|---|---|---|
IC555 | 1 set | Integrated Circuit | Component | |
Anti-static conductive foam | 1 set | For IC chip storage/packaging | Packaging |
External
To be published as part of the publication.
Item | Qty | Description | Category | Source |
---|---|---|---|---|
IC555 | 1 piece | Integrated Circuit | Component | |