Revision as of 00:03, 7 February 2023

Internal

For prototyping and preparing the packaging of the publication.

Graduation project & thesis
Item	Qty	Description	Category	Source
IC555	1 set	Integrated Circuit	Component
Anti-static conductive foam	1 set	For IC chip storage/packaging	Packaging

For publishing as part of the publication.

ChipF(r)ic v1.0
Item	Qty	Description	Category	Source
IC555	1 piece	Integrated Circuit	Component

@@ Line 1: / Line 1: @@
 =Internal=
-For testing and preparing the packaging of the publication.
+For prototyping and preparing the packaging of the publication.
 {| class="wikitable"
@@ Line 13: / Line 13: @@
 =External=
+For publishing as part of the publication.
+{| class="wikitable"
+|+ ChipF(r)ic v1.0
+|-
+! Item !! Qty !! Description !! Category !! Source
+|-
+| IC555 || 1 piece || Integrated Circuit || Component ||
+|-
+|  ||  ||  ||  ||
+|}
 ==ChipF(r)ic DIY circuit==